• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The present invention relates to a wafer chuck cleaning apparatus of a semiconductor stopper device. In the related art, an oil stone and an operator's hand must be inserted between a wafer chuck and a U-lens, which obscures the operator's field of vision, thereby making the work work by the senses. This is a reason for the progress, and the variation in work performance is greatly generated according to the skill of the operator, and if the U-lens is accidentally damaged, the recovery time is long and productivity is lowered. In the present invention, the wafer chuck is automatically configured by an oil stone moving up, down, left and right from the top of the wafer chuck, an oil stone driving means for moving the oil stone in a predetermined direction, and an agent supply means for supplying an agent to the oil stone. By providing a cleaning device that can be cleaned with water, the consistency of work performance is This has the effect of improving the productivity and prevent damage to the U- lens in advance.
    公开号:KR19980054410A
    申请号:KR1019960073571
    申请日:1996-12-27
    公开日:1998-09-25
    发明作者:이광석
    申请人:문정환；엘지반도체 주식회사；
    IPC主号:
    专利说明:

    Wafer Chuck Cleaning Device of Semiconductor Stepper Equipment
    BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to semiconductor stepper equipment, and more particularly, to a wafer chuck cleaning apparatus of a semiconductor stepper apparatus for automatically cleaning a wafer chuck of a stepper equipment.
    In order to clean the wafer chuck in the conventional stepper equipment, as shown in FIG. 1, a wafer chuck 2 is installed on the top surface of the chuck plate 1, and a predetermined interval is provided on the top of the wafer chuck 2. In the stepper equipment in which the U-lens 3 is installed, in case the foreign matter of the wafer chuck 2 occurs, the operator directly uses the separate oil stone 4 to directly top the wafer chuck 2. Cleaning was rubbed cotton.
    Here, the wafer chuck 2 is formed in a ring shape of aluminum and is supported by the chuck plate 1.
    In the conventional wafer chuck cleaning apparatus configured as described above, when there is an abnormality after exposing a sample wafer (not shown) and confirming the abnormality of the wafer chuck 2 before the formal exposure operation, the wafer chuck (first) 2) is moved to the cleaning position origin (X = 0, Y = 0), and the oil stone 4 is wafer chuck (2) in a state of moistening the upper surface of the wafer chuck 2 with a sponge or the like by moistening alcohol. Clean outwards while slowly rubbing from the center of the pan. In this case, the reason why the alcohol is wetted to the wafer chuck 2 is that the alcohol acts as a catalyst to help clean the lubrication function and foreign substances while preventing the chuck 2 from being damaged.
    Next, an air bubbler (not shown) was used to remove foreign matters and the like remaining on the cleaned wafer chuck 2, and to perform exposure again, and if there was no abnormality, the exposure work of the product wafer was performed immediately.
    However, in the conventional wafer chuck cleaning apparatus as described above, the oil stone 4 and the operator's hand must be inserted between the wafer chuck 2 and the U-lens 3 to perform the operation. As a result, the work by the senses is progressed, and the deviation of the work performance is greatly generated according to the skill level of the operator, and the recovery time is long when the U-lens 3 is accidentally damaged. There was a problem that the productivity is lowered.
    Accordingly, an object of the present invention is to provide a cleaning device capable of automatically cleaning the wafer chuck, thereby improving productivity as well as consistency in work performance and preventing damage to the U-lens.
    1 is a schematic view illustrating a cleaning process of a wafer chuck in a conventional semiconductor stepper device.
    Fig. 2 is a schematic view showing the structure of a cleaning apparatus for a wafer chuck in the semiconductor stepper equipment according to the present invention.
    Explanation of symbols on the main parts of the drawings
    10 Base 11 Chuck Plate
    12 wafer chuck 13 first cylinder
    14: second cylinder 15: oil stone driving motor
    16: oil stone 17: oil stone drive motor support
    In order to achieve the object of the present invention, an oil stone moving up, down, left, and right at the top of the wafer chuck, oil stone driving means for moving the oil stone in a predetermined direction, and agent supply for supplying an agent to the oil stone A wafer chuck cleaning apparatus for a semiconductor stopper is provided, which is constituted by means.
    EMBODIMENT OF THE INVENTION Hereinafter, the wafer chuck cleaning apparatus of the semiconductor stepper which concerns on this invention is demonstrated in detail based on one Example shown in an accompanying drawing.
    As shown in FIG. 2, the wafer chuck cleaning apparatus according to the present invention includes a base 10, a chuck plate 11 installed at the center of the top surface of the base 10, and an upper end of the chuck plate 11. A wafer chuck 12 provided on a surface, a first cylinder 13 provided on one side of the base 10, a second cylinder 14 provided on one side of the first cylinder 13, An oil stone driving motor 15 fixed to the lower side of the second cylinder 14 and an oil stone provided below the oil stone driving motor 15 and having a distribution port 16a radially formed therein ( 16), an oil stone driving motor support 17 installed on the upper surface of the chuck plate to hold the vibration of the oil stone driving motor 15, and the agent supply means 18 coupled to the second cylinder. do.
    The agent supply means 18 is provided with a conventional alcohol supply unit, a vacuum suction unit for sucking the foreign matter of the wafer chuck 12 and an air supply unit for drying the wafer chuck.
    The wafer chuck cleaning apparatus according to the present invention configured as described above first moves the wafer chuck 12 to the origin (X = 0, Y = 0), and then power is applied to the first cylinder 13. The oil stone 16 is moved above the central portion of the wafer chuck 12, and then the oil stone 16 is set on the top surface of the wafer chuck 12 by the second cylinder 14 so that the oil The top surface of the wafer chuck 12 is cleaned by the rotation of the stone driving motor 15.
    At this time, the oil stone 16 which is first supplied with alcohol from the agent supply means 18 is evenly sprayed onto the wafer chuck 12 through the distribution port 16a formed therein, and the oil stone While rotating the 16, the foreign material formed on the upper surface of the wafer chuck 12 is removed. In this process, the oil stone 16 is in a vacuum state and sucks the foreign matter.
    Next, when the foreign matter removing operation is completed, after drying the wafer chuck 12 while discharging air in the state that the oil stone 16 is spaced apart from the wafer chuck by a predetermined interval by the second cylinder (14) The oil stone 16 is moved to the original position by the first cylinder 13.
    As described above, the wafer chuck cleaning apparatus of the semiconductor stepper apparatus according to the present invention includes an oil stone moving up, down, left, and right from an upper portion of the wafer chuck, oil stone driving means for moving the oil stone in a predetermined direction, and It is composed of agent supply means for supplying agent to oil stone to provide cleaning device that can automatically clean wafer chuck, which improves productivity as well as consistency of work performance and prevents damage to U-lens in advance. have.
    权利要求:
    Claims (3)
    [1" claim-type="Currently amended] An oil stone moving up, down, left and right from the top of the wafer chuck, an oil stone driving means for moving the oil stone in a predetermined direction, and an agent supply means for supplying an agent to the oil stone. Wafer Chuck Cleaning Device.
    [2" claim-type="Currently amended] According to claim 1, wherein the oil stone driving means is a base installed in the lower portion of the wafer chuck, a first cylinder installed on one side of the base to move the oil stone left and right, combined with the first cylinder and oil A second cylinder for moving the stone up and down, an oil stone driving motor coupled to the second cylinder to rotate the oil stone, and an oil stone driving motor support installed at the upper side of the base to hold the vibration of the oil stone driving motor. Wafer chuck cleaning apparatus for semiconductor stepper equipment, characterized in that consisting of.
    [3" claim-type="Currently amended] The wafer chuck cleaning apparatus of claim 1, wherein a distribution port for distributing the agent evenly on the top surface of the wafer chuck is radially formed inside the oil stone.
    类似技术:
    公开号 | 公开日 | 专利标题
    US5384986A|1995-01-31|Polishing apparatus
    JP4423289B2|2010-03-03|Substrate cleaning apparatus, substrate cleaning method, and medium recording program used for the method
    KR100428881B1|2004-07-23|Method and apparatus for dressing a polishing surface of a polishing cloth
    US6409582B1|2002-06-25|Polishing apparatus
    TW417194B|2001-01-01|A cleaner
    US7470344B1|2008-12-30|Chemical dispensing system for semiconductor wafer processing
    TW384244B|2000-03-11|CMP pad maintenance apparatus and method
    JP3972065B2|2007-09-05|Silicon dust removal wafer grinding and polishing equipment
    KR100267618B1|2000-10-16|Process apparatus and process method
    US5868866A|1999-02-09|Method of and apparatus for cleaning workpiece
    KR0184991B1|1999-05-01|Surface polishing apparatus
    KR100500517B1|2005-07-12|CMP equipment to Semiconductor Wafer
    KR920010730B1|1992-12-14|Etching apparatus of semiconductor substrate
    US20030084925A1|2003-05-08|Substrate cleaning apparatus and substrate cleaning method
    US5651725A|1997-07-29|Apparatus and method for polishing workpiece
    JP3713447B2|2005-11-09|Development processing equipment
    JP3959028B2|2007-08-15|Apparatus and method for reducing contamination by particles on a substrate in a processing tool
    US6676765B2|2004-01-13|Method of removing particles and a liquid from a surface of substrate
    KR20020014992A|2002-02-27|Substrate cleaning apparatus
    KR900000174B1|1990-01-23|Apparatus for washing and drying substrates
    TW467807B|2001-12-11|Chemical mechanical polishing apparatus and method for washing contaminant off polishing head
    JP2001185523A|2001-07-06|Method and apparatus for cleaning/drying hydrophobic wafer
    KR0175278B1|1999-04-01|Wafer Cleaner
    TWI327132B|2010-07-11|
    JPH08279483A|1996-10-22|Method and equipment for removing particulate contamination thing from semiconductor wafer
    同族专利:
    公开号 | 公开日
    KR100214541B1|1999-08-02|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1996-12-27|Application filed by 문정환, 엘지반도체 주식회사
    1996-12-27|Priority to KR1019960073571A
    1998-09-25|Publication of KR19980054410A
    1999-08-02|Application granted
    1999-08-02|Publication of KR100214541B1
    优先权:
    申请号 | 申请日 | 专利标题
    KR1019960073571A|KR100214541B1|1996-12-27|1996-12-27|Wafer chuck cleaning device of semiconductor stepper|
    [返回顶部]